THICK-SCAN L measures thickness of boards without physical contact. This is made possible by laser sensors mounted on both sides of the board. The THICK-SCAN "L" (laser) is the preferred measuring method used for both soft boards and those with sensitive surfaces, such as insulation boards. The exact distance between the THICK-SCAN L laser sensors and the surface of the board is significant for measuring accuracy. That being the case, as an option, the THICK-SCAN L system can be designed with automatic up and down adjustments of the upper support-Beam. Thereby, the optimal measuring distance to the surface is secured as long as the board thickness varies between 10 and 300 mm (0.4-12). Within the board gaps, the system is automatically calibrated by the use of calibration samples. The sensing of the upper and lower laser sensors is synchronized so that the measurement is insensitive to up and down movements, as well as vibrations of the board during transport. Furthermore, on porous surfaces, the signal can be integrated and straightened. THICK-SCAN L can also measure average minimum or maximum thickness of panels with textured surfaces. Download PDF | Function: THICK-SCAN "L" measures the board thickness continuously, non-contact, during production. The laser measuring heads are mounted in pairs, opposite each other, allowing up and down movements and vibrations to be compensated. Installed on a roller belt conveyor Panel speed: 635 mm/s (25 IPS) Interruption-free power supply for PC
Benefits: Technical Data: Technology: Laser Triangulation Principle Laser class: 3B Laser output: 10 mW Measuring tracks: any number Accuracy: + 0.1 mm Air purchase: 4 bars (60 psi) Production speed: up to 180 m/min. (558 FPM)
Options: Computer System: 19-rack industry computer TFT 19 Monitor Wide range of primary power supply Operating system Windows XP Hard disc in exchangeable frame Server hard disc (24 h operation) RAID controller for backup (Copying to a second hard disc) Ethernet LAN
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